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Surgical Technologist jobs in hsinchu city


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Field Application Engineer
Company: Teradyne |

Location: Hsinchu City, Taiwan

| Salary: unspecified | Posted: 16 Mar 2018

Requisition ID 13609BR Duties & Responsibilities Customer Technologist (CTO) This is a senior role in the Device... with the HW Business Chief Technologist to develop and execute a technology roadmap with especially focused to the strategic...
Accounting Intern - General Ledger
Company: Logitech |

Location: Hsinchu City, Taiwan

| Salary: unspecified | Posted: 01 Jun 2018

Description The Role: Accounting Intern - General Ledger for controllership team is responsible for regular accounting routine to month end closing and financial audit activities. Your Contribution: Be Yourself. Be Open. Stay Hungry a...
Industrial Engineer Iv - (e4)
Company: Applied Materials |

Location: Hsinchu City, Taiwan

| Salary: unspecified | Posted: 01 Jun 2018

Requires specialized depth and/or breadth of expertise. Interprets internal or external business issues and recommends best practices. Solves complex problems; takes a broad perspective to identify innovative solutions. Works independently,...
Private School Position In Hsinchu - July And August 2018
Company: unknown |

Location: Hsinchu City, Taiwan

| Salary: unspecified | Posted: 01 Jun 2018

A popular and reputable language school in Zhubei, Hsinchu, Taiwan is looking for full-time experienced ESL instructors for summer 2018. This is a terrific school with loads of teaching resources and beautiful classrooms. Teachers can cou...
Scm Head(director)
Company: unknown |

Location: Hsinchu City, Taiwan

| Salary: unspecified | Posted: 01 Jun 2018

SCM head(Director) Company Nationality Taiwan Working Location HsinChu City/County Academic Background Bachelor English Proficiency Business Level Qualification 1.15年以上電子大廠SCM經驗.半導體/光電/lighting經驗優先 2.電子大廠SCM(生物管.資材.採購) 處長級以上經驗 3.英文流利...
Credit Head (rm) - Global Tech Company
Company: Michael Page |

Location: Hsinchu City, Taiwan

| Salary: unspecified | Posted: 31 May 2018

Relationship Manager ( Lead a team of 4 ) Client Details One of the most advanced and leading technology company with offices located across APAC and Europe. Description Produce credit related inputs in assistance of company's busin...
Wafer Level Sr. Quality Engineer
Company: Michael Page |

Location: Hsinchu City, Taiwan

| Salary: unspecified | Posted: 31 May 2018

Responsible for all wafer level quality control, development and sustaining activities at Taiwan subcons. Troubles shooting and implementation of corrective action on wafer level mfg. & shipment. Client Details Power IC design house i...
System Engineer (temporary Position Only)
Company: Qualcomm |

Location: Hsinchu City, Taiwan

| Salary: unspecified | Posted: 31 May 2018

Engineering - Systems Location Taiwan - Hsinchu Job Overview Chip bring up, system performance optimization Minimum Qualifications br/ - Excellent team player, communication, and interpersonal skills br/ - Strong analytical and prob...
Product Solution Sales Manager
Company: Synopsys |

Location: Hsinchu City, Taiwan

| Salary: unspecified | Posted: 31 May 2018

Requisition Number 17733BR Job Description and Requirements Responsible for sales of the entire portfolio of Synopsys IP products. Drives sales to obtain revenue and booking goals. Provides expert technical selling in a team environment t...
R&d Engineer, Sr I
Company: Synopsys |

Location: Hsinchu City, Taiwan

| Salary: unspecified | Posted: 31 May 2018

Requisition Number 17837BR Job Description and Requirements Responsible for designing, developing, troubleshooting, or debugging software programs. Develops software tools including operating systems, compilers, routers, networks, utiliti...
Senior Engineer, Assembly Packaging
Company: Adecco |

Location: Hsinchu City, Taiwan

| Salary: unspecified | Posted: 31 May 2018

Key Responsibilities Directly report to Head of Packaging & Assembly Operations Responsible for package development programs and Assy performance for Taiwan subcons Subject Matter Expert in either Wire Bond, Bumping or Flipchip BGA proc...
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