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Packaging jobs in taichung city

1 to 40 of 77 packaging jobs in taichung city

Senior Engineer, Packaging Engineering Job
Company: SanDisk |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 30 Sep 2017

and packaging groups at various SanDisk locations for new product development and substrate / PCB design improvement. Work...
Packaging Engineer
Company: unknown |

Location: Taichung City, Taiwan

| Salary: 35000 per month | Posted: 20 Oct 2017

操作技術 產業類別: 各種機械加工 工作說明: packaging engineering 工作地區: 台中市 薪 資: NTD / 月薪 35,000 需求學位: 不拘 經歷...及專長: packaging engineering experience...
502945080, H21b10
Company: Corning |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 20 Oct 2017

processes that involves-Cutting, grinding, polishing, washing and assembly/packaging of final products. Transfer of technology...
Sr. Control Systems Engineer
Company: Corning |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 20 Oct 2017

processes that involves-Cutting, grinding, polishing, washing and assembly/packaging of final products. Transfer of technology...
Sr. Control Systems Engineer
Company: Corning |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 20 Oct 2017

processes that involves-Cutting, grinding, polishing, washing and assembly/packaging of final products. Transfer of technology...
Senior Engineer - Package Integration
Company: Micron |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 07 Oct 2017

Req. ID: 89706 As a Package Process Integration Engineer in Micron's Advanced Packaging Technology Development Group..., you will be responsible for driving and delivering new advanced packaging technologies for next generation products. You will collaborate...
Senior Engineer - Package Integration
Company: Micron Technology |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 07 Oct 2017

Req. ID: 89706 As a Package Process Integration Engineer in Micron's Advanced Packaging Technology Development Group..., you will be responsible for driving and delivering new advanced packaging technologies for next generation products. You will collaborate...
Assembly Pie/npi Engineer
Company: Micron |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 29 Sep 2017

packaging solutions and ensure first pass NPI qualification. Provide ideas for cost reduction and process simplification... optimization to drive best in class packaging solutions and ensure first pass NPI qualification. Provide ideas for cost reduction...
Bece Senior Pie Engineer
Company: Micron |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 29 Sep 2017

(New Product Introduction) to product end-of-life. Defining the Build of Material (BOM) for all packaging and module level... across functions to successfully launch new technologies in packaging. Support customer audits. Use structured problem solving...
Assembly Pie/npi Engineer
Company: Micron Technology |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 29 Sep 2017

packaging solutions and ensure first pass NPI qualification. Provide ideas for cost reduction and process simplification... optimization to drive best in class packaging solutions and ensure first pass NPI qualification. Provide ideas for cost reduction...
Bece Senior Pie Engineer
Company: Micron Technology |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 29 Sep 2017

(New Product Introduction) to product end-of-life. Defining the Build of Material (BOM) for all packaging and module level... across functions to successfully launch new technologies in packaging. Support customer audits. Use structured problem solving...
Senior/principal Dicing Engineer- Advanced Package Development
Company: Micron |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 23 Sep 2017

Req. ID: 90826 Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging... solutions 1. Job function - New process development engineering in stealth dicing and De-bond technology for packaging...
Senior/principal Rda Engineer - Advanced Package Developmen
Company: Micron |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 23 Sep 2017

Req. ID: 93925 Job descrption Works in the advanced packaging technology development (APTD) team in Micron Taiwan...
Senior/principal Wet Process Engineer - Advanced Package Development
Company: Micron |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 23 Sep 2017

Req. ID: 89582 Micron currently has an opening for a Wet process Engineer in the Advanced Packaging Technology...
Senior/principal Wet Process Engineer - Advanced Package Development
Company: Micron Technology |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 23 Sep 2017

Req. ID: 89582 Micron currently has an opening for a Wet process Engineer in the Advanced Packaging Technology...
Senior/principal Dicing Engineer- Advanced Package Development
Company: Micron Technology |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 23 Sep 2017

Req. ID: 90826 Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging... solutions 1. Job function - New process development engineering in stealth dicing and De-bond technology for packaging...
Senior/principal Rda Engineer - Advanced Package Developmen
Company: Micron Technology |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 23 Sep 2017

Req. ID: 93925 Job descrption Works in the advanced packaging technology development (APTD) team in Micron Taiwan...
Global Immersion Initiative- Taiwan Opportunities
Company: Micron |

Location: Taoyuan District Taoyuan City - Taichung City, Taiwan

| Salary: unspecified | Posted: 21 Sep 2017

, as well as Taiwan's first automated back-end plant established in 2017, including for high-end 3DI DRAM packaging. Micron...
Quality Management Office Subcon Auditor
Company: Micron |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 15 Sep 2017

’s subcontractors. The subcontractors provide outsourcing services to Micron that include component assembly and packaging, electrical...
Quality Management Office Subcon Auditor
Company: Micron Technology |

Location: Taichung City, Taiwan

| Salary: unspecified | Posted: 15 Sep 2017

’s subcontractors. The subcontractors provide outsourcing services to Micron that include component assembly and packaging, electrical...
Engineer - Process Development
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

New process development engineering in molding technology for mobile memory packaging application... Knowledge of conventional wiring bonding packaging solution. Knowledge of substrate technology and...
Spectek Production Operations Supervisor
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Determine area equipment setup and equipment operator ratio. Maintain sufficient levels of area operating materials and packaging supplies. Manage and Develop Employee Performance. Provide...
Aptd Principal Engieer-process Development
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

New process development engineering in molding technology for mobile memory packaging application... Knowledge of conventional wiring bonding packaging solution. Knowledge of substrate technology and...
Control Systems Engineer
Company: Corning |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 12 Oct 2017

Ceramics glass firing annealing, ware handling and finishing processes that involves Cutting, grinding, polishing, washing and assembly packaging of final products. Transfer of technology to...
Senior/principal Wet Process Engineer - Advanced Package Development
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Company. Micron. Req. ID. 89582. Micron currently has an opening for a Wet process Engineer in the Advanced Packaging Technology Development organization located in Taichung. The engineer is...
Assembly Pie/npi Engineer
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Participate in process and material optimization to drive best in class packaging solutions and ensure... Participate in process and material optimization to drive best in class packaging solutions and ensure...
Bct Ace Senior Product Engineer
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Include and not limited to the following. Product transfer from 1st site to 2nd site. Apply copy smart as possible. Defining the Build of Material (BOM) for all packaging level products. Ensure...
Pqra Package Lab Technician (mtb)
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Materials Engineering, Materials Science, Mechanical Engineering is preferred. 1 year experience in any of the following. Electronic Packaging, Lab Tech, Semiconductor Packaging. Proficient in...
Engineering Data Engineer
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Team player with good communication and interpersonal skills. Some English will be an advantage. Experience in semiconductor manufacturing and packaging is an advantage...
Bct Materials Substrate Engineer
Company: Micron Technology, Inc. |

Location: Taichung, Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Experience w. many packaging technologies (Board on Chip, Chip on Board, Flip Chip in Package, Cu... Working knowledge of Packaging Quality and Reliability tests and requirements. Decision making skills...
Assembly Product Integration Engineer - Product Proliferation
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Include and not limited to the following. Product transfer from 1st site to 2nd site. Apply copy smart as possible. Defining the Build of Material (BOM) for all packaging level products. Ensure...
Sr. Control Systems Engineer
Company: Corning |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 17 Oct 2017

Ceramics glass firing annealing, ware handling and finishing processes that involves Cutting, grinding, polishing, washing and assembly packaging of final products. Transfer of technology to...
502945080, H21b10
Company: Corning |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 18 Oct 2017

Ceramics glass firing annealing, ware handling and finishing processes that involves Cutting, grinding, polishing, washing and assembly packaging of final products. Transfer of technology to...
Senior/principal Rda Engineer - Advanced Package Developmen
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Company. Micron. Req. ID. 93925. Job descrption. Works in the advanced packaging technology development (APTD) team in Micron Taiwan Backend (MTB) at Taichung for advanced 3DI package...
Quality Management Office Subcon Auditor
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

The subcontractors provide outsourcing services to Micron that include component assembly and packaging, electrical test, memory module assembly, and SSD assembly. You will be the primary...
Package Reliability Engineer
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Education. Minimum of BS degree or equivalent experience in Engineering or a related field of study. Five years of experience in Micro Electronic Packaging, Quality Reliability Engineering...
Senior/principal Dicing Engineer- Advanced Package Development
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging... New process development engineering in stealth dicing and De bond technology for packaging application...
Bece Senior Pie Engineer
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Product lifecycle management and execution from development (New Product Introduction) to product end of life. Defining the Build of Material (BOM) for all packaging and module level products...
Bct Materials Engineer (polymer Materials)
Company: Micron Technology, Inc. |

Location: Taichung, Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Collaborate with the Advanced Packaging Technology Development (APTD) team to enable New Product... Working knowledge of Packaging Quality and Reliability tests and requirements. Background in Chemistry...
Assembly Equipment Engineer
Company: Micron Technology, Inc. |

Location: (Unspecified city), Taichung, TW

| Salary: unspecified | Posted: 11 Oct 2017

Handles moderately complex , important engineering projects. Develop in depth understanding and knowledge on related field. Conduct feasibility studies on new product packaging method and...