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Floor Layer jobs in Taiwan

2 floor layer jobs

Package Design Engineer (senior/staff)
Qualcomm

Hsinchu City

19 Oct 2016
die keeping in mind package footprint/height constraints , IC floor-planning , PCB ,high-speed signal integrity , power... expertise in 2-4 layer laminate and/or non laminate substrate technologies (BGA & LGA) br/ br/ Additional Knowledge/Skills...
Package Design Engineer (senior/staff)
Qualcomm Technologies, Inc.

(Unspecified city), TW

05 Dec 2016
Additional responsibilities. IC top level floorplanning including hard macro block placement, padring... 0. years of Package Design expertise in 2 4 layer laminate and or non laminate substrate technologies...